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Home/e-Resources/Electronics & Telecommunication Engineering/Influence of Ag Addition to Sn-Bi Eutectic Alloy on Microstructure and on Mechanical Properties
PeriodicalsElectronics & Telecommunication Engineering

Influence of Ag Addition to Sn-Bi Eutectic Alloy on Microstructure and on Mechanical Properties

Katsuaki Suganuma·Taiji Sakai·Keun‐Soo Kim
Journal of The Japan Institute of Electronics Packaging2003

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Abstract & Overview

Sn-57Bi合金にAg添加し, その延性改善効果を調べた。溶解温度が低くAg添加量の多い場合に粗大なAg3Sn初晶が形成し, Scheilシミュレーションでは0.5mass%以上のAg添加で初晶Ag3Sn形成が予測され, その温度はAg添加量とともに急激に上昇し, 1mass%Ag合金では200℃を越える。引張試験で歪み速度を増加させた場合, 破断モードの変化からσ-ε関係は対数則から外れ, 破断伸びは著しく減少する。300℃鋳造合金は, 0.5mass%Agで引張強度と破断伸びは最も大きくなり, 時効の影響は少ない。180℃鋳造合金は, Ag量増加に伴い粗大な初晶Ag3Snが増加し, 徐々に破断伸びが減少する。

Cite this record

Katsuaki Suganuma, Taiji Sakai, Keun‐Soo Kim (2003). Influence of Ag Addition to Sn-Bi Eutectic Alloy on Microstructure and on Mechanical Properties. Journal of The Japan Institute of Electronics Packaging, 6(5), 414–419. https://doi.org/10.5104/jiep.6.414

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Suganuma, K., Sakai, T., & Kim, K. (2003). Influence of Ag Addition to Sn-Bi Eutectic Alloy on Microstructure and on Mechanical Properties. Journal of The Japan Institute of Electronics Packaging, 6(5), 414–419. https://doi.org/10.5104/jiep.6.414
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