We use a few cookies

Essential cookies keep the library working. With your permission, we'd also like to use analytics to see what's useful and improve the experience. Read our Privacy Policy or Cookie Policy.

Skip to main content
Home/e-Resources/Electrical Engineering/Three-Dimensional (3D) Device Architectures Enabled by Oxidative Chemical Vapor Deposition (oCVD)
PeriodicalsElectrical Engineering

Three-Dimensional (3D) Device Architectures Enabled by Oxidative Chemical Vapor Deposition (oCVD)

Checking your access to this record.

Abstract & Overview

For fabricating devices with three-dimensional (3D) architectures, oxidative chemical vapor deposition (oCVD) offers conformal nanocoatings of polymers with designable composition. Pure, uniform, and pinhole-free oCVD layers are achievable with sub-10 nm thickness and sub-1 nm roughness. The low substrate temperature used for oCVD allows direct deposition on to the thermally sensitive substrates desired for flexible and wearable devices. The oCVD polymers can graft to the underlying material. The covalent chemical bonds to the substrate create a robust interface that prevents delamination during the subsequent device fabrication steps and exposure to the environmental conditions of device operation. Both electrically conducting and semiconducting polymers have been synthesized by oCVD. Small ions act as dopants. The oCVD process allows for systematic tuning of electrical, optical, thermal, and ionic transport properties. Copolymerization with oCVD can incorporate specific organic functional groups into the resulting conjugated organic materials. This short review highlights recent examples of using oCVD polymer to fabricate organic and hybrid organic–inorganic devices. These optoelectronic, electrochemical, and sensing devices utilize 3D architectures made possible by the conformal nature of the oCVD polymers. Introduction oCVD Chemistry and Process Optoelectronic Devices Electrochemical Devices Sensing Devices Conclusions and Outlook

Cite this record

Karen K. Gleason (2022). Three-Dimensional (3D) Device Architectures Enabled by Oxidative Chemical Vapor Deposition (oCVD). Organic Materials, 4(04), 261–267. https://doi.org/10.1055/a-1982-7432

Copy in another style

Gleason, K. K. (2022). Three-Dimensional (3D) Device Architectures Enabled by Oxidative Chemical Vapor Deposition (oCVD). Organic Materials, 4(04), 261–267. https://doi.org/10.1055/a-1982-7432
Author names are used as deposited, so check their order before you submit.

Metadata is harvested from open-access indexes and can be incomplete. Check a citation against the published version before relying on it — see our open access & attribution policy.